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MID (Molded Interconnect Device)

Forming patterns on complex 3D shapes - Molded circuit components "MID" [Contributes to "miniaturization," "lightweight," and "thinness."]

MID (Molded Interconnect Device) refers to plastic injection molded products with electrical circuit wiring that possess both mechanical and electrical functions. Its features include simplification of wiring between electrical components, miniaturization of devices through space-saving wiring arrangements, and increased design flexibility through direct implementation onto three-dimensional molded parts. It is increasingly adopted in wearable devices, automobiles, and small medical devices. We offer proposals for miniaturizing and thinning electronic devices, handling everything from molding to pattern design. **Advantages of MID:** - **Lightweight:** Directly drawing patterns onto plastic molded products eliminates the need for separate circuit boards and their screws, leading to weight reduction. - **Compactness:** It can be implemented in three dimensions, contributing to the miniaturization of components in a space-saving manner. - **Simplified Assembly:** Reducing the assembly labor for circuit module boards leads to higher precision. *For more details, please contact us.*

  • Plating Equipment

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What is the technology 'MID' that replaces PCB and FPC for miniaturization of resin molded products?

MID enables wiring formation that does not rely on circuit boards or harnesses, contributing to thinner, smaller, and lighter designs through the reduction of component count.

3D-MID refers to molded circuit components that directly incorporate wiring into plastic injection molded products. By three-dimensional wiring of the housing as part of the printed circuit board, it enables the miniaturization, thinness, lightweight, and enhancement of product functionality. Currently, there are mainly two types of methods for 3D-MID: the two-shot molding method and the laser method. Within these two types, there are several additional techniques. 【Features of MID】 - Direct wiring and component mounting on the housing enable miniaturization, thinness, and lightweight design. - Reduction in the number of components (material savings). - Reduction in assembly labor. - Cost reduction due to the decrease in the number of components and assembly labor. - By combining printed circuit boards with 3D-MID, it addresses the high-density products that cannot be managed by printed circuit boards alone. *For more details, please refer to the related links or feel free to contact us.

  • Other CAD
  • Other contract services

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